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?2004 integrated device technology, inc. june 2004 dsc-3242/12 1 functional block diagram features: true dual-ported memory cells which allow simultaneous access of the same memory location high-speed clock to data access ? commercial: 6/7/9/12/15ns (max.) ? industrial: 12ns (max.) low-power operation ? idt709089/79s active: 950mw (typ.) standby: 5mw (typ.) ? idt709089/79l active: 950mw (typ.) standby: 1mw (typ.) flow-through or pipelined output mode on either port via the ft /pipe pin counter enable and reset features dual chip enables allow for depth expansion without additional logic full synchronous operation on both ports ? 4ns setup to clock and 1ns hold on all control, data, and address inputs ? data input, address, and control registers ? fast 6.5ns clock to data out in the pipelined output mode ? self-timed write allows fast cycle time ? 10ns cycle time, 100mhz operation in the pipelined output mode ttl- compatible, single 5v (10%) power supply industrial temperature range (?40c to +85c) is available for selected speeds available in 100-pin thin quad flatpack (tqfp) package high-speed 64/32k x 8 synchronous dual-port static ram idt709089/79s/l 0 1 0/1 1 0/1 0 r/ w r oe r ce 0r ce 1r ft /pipe r i/o control memory array counter/ address reg. i/o control 3242 drw 01 a 15r (1) a 0r clk r ads r cnten r cntrst r a 0l clk l ads l a 15l (1) cnten l cntrst l counter/ address reg. r/ w l ce 0l oe l ce 1l i/o 0l -i/o 7l i/o 0r - i/o 7r . 1 0/1 0 0 1 0/1 ft /pipe l note: 1. a 15 x is a nc for idt709079.
6.42 idt709089/79s/l high-speed 64/32k x 8 synchronous dual-port static ram industrial and commercial temperature rang es 2 description: the idt709089/79 is a high-speed 64/32k x 8 bit synchronous dual- port ram. the memory array utilizes dual-port memory cells to allow simultaneous access of any address from both ports. registers on control, data, and address inputs provide minimal setup and hold times. the timing latitude provided by this approach allows systems to be designed with very short cycle times. pin configuration (1,2,3) notes: 1. a 15 x is a nc for idt709079. 2. all v cc pins must be connected to power supply. 3. all gnd pins must be connected to ground supply. 4. package body is approximately 14mm x 14mm x 1.4mm. 5. this package code is used to reference the package diagram. 6. this text does not indicate orientation of the actual part-marking. with an input data register, the idt709089/79 has been optimized for applications having unidirectional or bidirectional data flow in bursts. an automatic power down feature, controlled by ce 0 and ce 1, permits the on-chip circuitry of each port to enter a very low standby power mode. fabricated using idt?s cmos high-performance technology, these devices typically operate on only 950mw of power. index 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 10099 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 idt709089/79pf pn100-1 (5) 100-pin tqfp top view (6) nc gnd ft /pipe r oe r r/ w r cntrst r ce 1r ce 0r nc nc gnd a 15r a 12r a 13r a 11r a 10r a 9r a 8r a 7r nc nc a 14r nc nc nc 3242 drw 02 nc nc ft /pipe l oe l r/ w l cntrst l ce 1l ce 0l nc nc nc v cc nc a 15l a 14l a 13l a 8l a 7l nc nc nc a 12l a 11l a 10l a 9l n c n c i / o 6 r i / o 5 r i / o 4 r i / o 3 r v c c i / o 2 r i / o 0 r g n d v c c i / o 0 l i / o 1 l g n d i / o 2 l i / o 4 l i / o 5 l i / o 6 l i / o 7 l i / o 3 l i / o 1 r i / o 7 r g n d n c n c n c n c a 6 r a 5 r a 4 r a 3 r a 2 r a 1 r a 0 r c n t e n r c l k r a d s r a d s l c l k l c n t e n l a 0 l g n d a 2 l a 3 l a 5 l a 6 l n c n c a 1 l a 4 l 08/19/03
6.42 idt709089/79s/l high-speed 64/32k x 8 synchronous dual-port static ram industrial and commercial temperature rang es 3 notes: 1. "h" = v ih, "l" = v il, "x" = don't care. 2. ce 0 and oe = v il ; ce 1 and r/ w = v ih . 3. outputs configured in flow-through output mode; if outputs are in pipelined mode the data out will be delayed by one cycle. 4. ads is independent of all other signals including ce 0 and ce 1 . 5. the address counter advances if cnten = v il on the rising edge of clk, regardless of all other signals including ce 0 and ce 1 . truth table ii?address counter control (1,2) truth table i? read/write and enable control (1,2,3) notes: 1. "h" = v ih, "l" = v il, "x" = don't care. 2. ads , cnten , cntrst = x. 3. oe is an asynchronous input signal. oe clk ce 0 ce 1 r/ w i/o 0-7 mode x h x x high-z deselected x x l x high-z deselected x lhl d in write l lhhd out read h x l h x high-z outputs disabled 3242 tbl 02 external address previous internal address internal address used clk ads cnten cntrst i/o (3) mode an x an l (4) xhd i/o (n) external address used xanan + 1 h l (5) hd i/o (n+1) counter enabled?internal address generation x an + 1 an + 1 hh hd i/o (n+1) external address blocked?counter disabled (an + 1 reused) xxa 0 xx l (4) d i/o (0) counter reset to address 0 5640 tbl 03 pin names left port right port names ce 0l , ce 1l ce 0r , ce 1r chip enables r/ w l r/ w r read/write enable oe l oe r output enable a 0l - a 15l (1) a 0r - a 15r (1) address i/o 0l - i/o 7l i/o 0r - i/o 7r data input/output clk l clk r clock ads l ads r address strobe cnten l cnten r counter enable cntrst l cntrst r counter reset ft /pipe l ft /pipe r flow-through/pipeline v cc power gnd ground 3242 tbl 01 note: 1. a 15 x is a nc for idt709079.
6.42 idt709089/79s/l high-speed 64/32k x 8 synchronous dual-port static ram industrial and commercial temperature rang es 4 recommended dc operating conditions recommended operating temperature and supply voltage (1) notes: 1. stresses greater than those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. v term must not exceed v cc + 10% for more than 25% of the cycle time or 10ns maximum, and is limited to < 20ma for the period of v term > v cc + 10%. 3. ambient temperature under dc bias. no ac conditions. chip deselected. absolute maximum ratings (1) notes: 1. these parameters are determined by device characterization, but are not production tested. 2. 3dv references the interpolated capacitance when the input and output switch from 0v to 3v or from 3v to 0v. 3. c out also references c i/o . capacitance (1) (t a = +25c, f = 1.0mh z ) notes: 1. this is the parameter t a . this is the "instant on" case temperature. notes: 1. v term must not exceed v cc + 10%. 2. v il > -1.5v for pulse width less than 10ns. grade ambient tem perature gnd v cc commercial 0 o c to +70 o c0v 5.0v + 10% industrial -40 o c to +85 o c0v 5.0v + 10% 3242 tbl 04 symbol parameter min. typ. max. unit v cc supply voltage 4.5 5.0 5.5 v gnd ground 0 0 0 v v ih input high voltage 2.2 ____ 6.0 (1) v v il input low voltage -0.5 (2) ____ 0.8 v 3242 tbl 05 symbol rating commercial & industrial unit v term (2) terminal voltage with respect to gnd -0.5 to +7.0 v t bias temperature under bias -55 to +125 o c t stg storage temperature -65 to +150 o c t jn junction temperature +150 o c i out dc output current 50 ma 3242 tbl 06 symbol parameter conditions (2 ) max. unit c in inp ut cap acitance v in = 3dv 9 pf c out (3 ) output capacitance v out = 3dv 10 pf 3242 tbl 07 dc electrical characteristics over the operating temperature and supply voltage range (v cc = 5.0v 10%) note: 1. at v cc < 2.0v input leakages are undefined. symbol parameter test conditions 709089/79s/l unit min. max. |i li | input leakage current (1) v cc = 5.5v, v in = 0v to v cc ___ 10 a |i lo | output leakage current ce 0 = v ih or ce 1 = v il , v out = 0v to v cc ___ 10 a v ol output low voltage i ol = +4ma ___ 0.4 v v oh output high voltage i oh = -4ma 2.4 ___ v 3242 tbl 08
6.42 idt709089/79s/l high-speed 64/32k x 8 synchronous dual-port static ram industrial and commercial temperature rang es 5 notes: 1. at f = f max , address and control lines (except output enable) are cycling at the maximum frequency clock cycle of 1/t cyc , using "ac test conditions" at input levels of gnd to 3v. 2. f = 0 means no address, clock, or control lines change. applies only to input at cmos level standby. 3. port "a" may be either left or right port. port "b" is the opposite from port "a". 4. v cc = 5v, ta = 25c for typ, and are not production tested. i cc dc (f=0) = 150ma (typ). 5. ce x = v il means ce 0x = v il and ce 1x = v ih ce x = v ih means ce 0x = v ih or ce 1x = v il ce x < 0.2v means ce 0x < 0.2v and ce 1x > v cc - 0.2v ce x > v cc - 0.2v means ce 0x > v cc - 0.2v or ce 1x < 0.2v "x" represents "l" for left port or "r" for right port. 6. 'x' in part numbers indicate power (s or l). dc electrical characteristics over the operating temperature and supply voltage range (6) (v cc = 5v 10%) 709089/79x6 com'l only 709089/79x7 com'l only 709089/79x9 com'l only symbol parameter test condition version typ. (4) max. typ. (4) max. typ. (4) max. unit i cc dynamic operating current (both ports active) ce l and ce r = v il outputs disabled f = f max (1) com'l s l 270 270 585 525 250 250 490 440 210 210 390 350 ma ind s l ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ i sb1 standby current (both ports - ttl level inputs) ce l = ce r = v ih f = f max (1) com'l s l 80 80 205 175 65 65 170 145 50 50 135 115 ma ind s l ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ i sb2 standby current (one port - ttl level inputs) ce "a" = v il and ce "b" = v ih (3) active port outputs disabled, f=f max (1) com'l s l 180 180 405 360 160 160 340 295 140 140 270 240 ma ind s l ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ i sb3 full standby current (both ports - cmos level inputs) both ports ce r and ce l > v cc - 0.2v v in > v cc - 0.2v or v in < 0.2v, f = 0 (2) com'l s l 1.0 0.2 15 5 1.0 0.2 15 5 1.0 0.2 15 5 ma ind s l ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ i sb4 full standby current (one port - cmos level inputs) ce "a" < 0.2v and ce "b" > v cc - 0.2v (5) v in > v cc - 0.2v or v in < 0.2v, active port outputs disabled, f = f max (1) com'l s l 170 170 395 340 150 150 330 290 130 130 245 225 ma ind s l ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ 3242 tbl 09
6.42 idt709089/79s/l high-speed 64/32k x 8 synchronous dual-port static ram industrial and commercial temperature rang es 6 notes: 1. at f = f max , address and control lines (except output enable) are cycling at the maximum frequency clock cycle of 1/t cyc , using "ac test conditions" at input levels of gnd to 3v. 2. f = 0 means no address, clock, or control lines change. applies only to input at cmos level standby. 3. port "a" may be either left or right port. port "b" is the opposite from port "a". 4. v cc = 5v, ta = 25c for typ, and are not production tested. i cc dc (f=0) = 150ma (typ). 5. ce x = v il means ce 0x = v il and ce 1x = v ih ce x = v ih means ce 0x = v ih or ce 1x = v il ce x < 0.2v means ce 0x < 0.2v and ce 1x > v cc - 0.2v ce x > v cc - 0.2v means ce 0x > v cc - 0.2v or ce 1x < 0.2v "x" represents "l" for left port or "r" for right port. 6. 'x' in part numbers indicate power (s or l). dc electrical characteristics over the operating temperature and supply voltage range (6) (v cc = 5v 10%)(cont'd) 709089/79x12 com'l & ind 709089/79x15 com'l only symbol parameter test condition version typ. (4) max. typ. (4) max. unit i cc dynamic operating current (both ports active) ce l and ce r = v il outputs disabled f = f max (1) com'l s l 200 200 345 305 190 190 325 285 ma ind s l 200 200 380 340 ____ ____ ____ ____ i sb1 standby current (both ports - ttl leve l inp uts) ce l = ce r = v ih f = f max (1) com'l s l 50 50 110 90 50 50 110 90 ma ind s l 50 50 125 105 ____ ____ ____ ____ i sb2 standby current (one port - ttl leve l inp uts) ce "a" = v il and ce "b" = v ih (3) active port outputs disabled, f=f max (1) com'l s l 130 130 230 200 120 120 220 190 ma ind s l 130 130 245 215 ____ ____ ____ ____ i sb3 full standby current (both ports - cmos level inputs) both ports ce r and ce l > v cc - 0.2v v in > v cc - 0.2v or v in < 0.2v, f = 0 (2) com'l s l 1.0 0.2 15 5 1.0 0.2 15 5 ma ind s l 1.0 0.2 15 5 ____ ____ ____ ____ i sb4 full standby current (one port - cmos level inputs) ce "a" < 0.2v and ce "b" > v cc - 0.2v (5) v in > v cc - 0.2v or v in < 0.2v, active port outputs disabled, f = f max (1) com'l s l 120 120 205 185 110 110 195 175 ma ind s l 120 120 220 200 ____ ____ ____ ____ 3242 tbl 09a
6.42 idt709089/79s/l high-speed 64/32k x 8 synchronous dual-port static ram industrial and commercial temperature rang es 7 ac test conditions figure 1. ac output test load. figure 2. output test load (for t cklz , t ckhz , t olz , and t ohz ). *including scope and jig. figure 3. typical output derating (lumped capacitive load). input pulse levels input rise/fall times input timing reference levels output reference levels output load gnd to 3.0v 3ns max. 1.5v 1.5v figures 1,2 and 3 3242 tbl 10 3242 drw 05 893 ? 30pf 347 ? 5v data out 893 ? 5pf* 347 ? 5v data out 3242 drw 04 1 2 3 4 5 6 7 8 20 40 100 60 80 120 140 160 180 200 tcd 1 , tcd 2 (typical, ns) capacitance (pf) 3242 drw 06 -1 0 -10 pf is the i/o capacitance of this device, and 30pf is the ac test load capacitance ,
6.42 idt709089/79s/l high-speed 64/32k x 8 synchronous dual-port static ram industrial and commercial temperature rang es 8 notes: 1. transition is measured 0mv from low or high-impedance voltage with the output test load (figure 2). this parameter is guarant eed by device characterization, but is not production tested. 2. the pipelined output parameters (t cyc2 , t cd2 ) apply to either or both left and right ports when ft /pipe = v ih . flow-through parameters (t cyc1 , t cd1 ) apply when ft /pipe = v il for that port. 3. all input signals are synchronous with respect to the clock except for the asynchronous output enable ( oe ) and ft /pipe. ft /pipe should be treated as a dc signal, i.e. steady state during operation. 4. 'x' in part number indicates power rating (s or l). ac electrical characteristics over the operating temperature range (read and write cycle timing) (3,4) (v cc = 5v 10%, t a = 0c to +70c) 709089/79x6 com'l only 709089/79x7 com'l only 709089/79x9 com'l only 709089/79x12 com'l & ind 709089/79x15 com'l only symbol parameter min.max.min.max.min.max.min.max.min.max.unit t cyc1 clock cycle time (flow-through) (2) 19 ____ 22 ____ 25 ____ 30 ____ 35 ____ ns t cyc2 clock cycle time (pipelined) (2) 10 ____ 12 ____ 15 ____ 20 ____ 25 ____ ns t ch1 clock high time (flow-through) (2) 6.5 ____ 7.5 ____ 12 ____ 12 ____ 12 ____ ns t cl1 clock low time (flow-through) (2) 6.5 ____ 7.5 ____ 12 ____ 12 ____ 12 ____ ns t ch2 clock high time (pipelined) (2) 4 ____ 5 ____ 6 ____ 8 ____ 10 ____ ns t cl2 clock low time (pipelined) (2) 4 ____ 5 ____ 6 ____ 8 ____ 10 ____ ns t r clock rise time ____ 3 ____ 3 ____ 3 ____ 3 ____ 3ns t f clock fall time ____ 3 ____ 3 ____ 3 ____ 3 ____ 3ns t sa address setup time 3.5 ____ 4 ____ 4 ____ 4 ____ 4 ____ ns t ha address hold time 0 ____ 0 ____ 1 ____ 1 ____ 1 ____ ns t sc chip enable setup time 3.5 ____ 4 ____ 4 ____ 4 ____ 4 ____ ns t hc chip enable hold time 0 ____ 0 ____ 1 ____ 1 ____ 1 ____ ns t sw r/ w setup time 3.5 ____ 4 ____ 4 ____ 4 ____ 4 ____ ns t hw r/ w hold time 0 ____ 0 ____ 1 ____ 1 ____ 1 ____ ns t sd input data setup time 3.5 ____ 4 ____ 4 ____ 4 ____ 4 ____ ns t hd input data hold time 0 ____ 0 ____ 1 ____ 1 ____ 1 ____ ns t sad ads setup time 3.5 ____ 4 ____ 4 ____ 4 ____ 4 ____ ns t had ads hold time 0 ____ 0 ____ 1 ____ 1 ____ 1 ____ ns t scn cnten setup time 3.5 ____ 4 ____ 4 ____ 4 ____ 4 ____ ns t hcn cnten hold time 0 ____ 0 ____ 1 ____ 1 ____ 1 ____ ns t srst cntrst setup time 3.5 ____ 4 ____ 4 ____ 4 ____ 4 ____ ns t hrst cntrst hold time 0 ____ 0 ____ 1 ____ 1 ____ 1 ____ ns t oe output enable to data valid ____ 6.5 ____ 7.5 ____ 9 ____ 12 ____ 15 ns t olz output enable to output low-z (1) 2 ____ 2 ____ 2 ____ 2 ____ 2 ____ ns t ohz output enable to output high-z (1) 17 17 17 17 17ns t cd1 clock to data valid (flow-through) (2) ____ 15 ____ 18 ____ 20 ____ 25 ____ 30 ns t cd2 clock to data valid (pipelined) (2) ____ 6.5 ____ 7.5 ____ 9 ____ 12 ____ 15 ns t dc data output hold after clock hig h 2 ____ 2 ____ 2 ____ 2 ____ 2 ____ ns t ckhz clo ck high to outp ut hig h-z (1) 2929292929ns t cklz clock high to output low-z (1) 2 ____ 2 ____ 2 ____ 2 ____ 2 ____ ns port-to-port delay t cwdd write port clock high to read data delay ____ 24 ____ 28 ____ 35 ____ 40 ____ 50 ns t ccs clock-to-clock setup time ____ 9 ____ 10 ____ 15 ____ 15 ____ 20 ns 3242 tbl 11
6.42 idt709089/79s/l high-speed 64/32k x 8 synchronous dual-port static ram industrial and commercial temperature rang es 9 timing waveform of read cycle for flow-through output ( ft /pipe "x" = v il ) (3,6) timing waveform of read cycle for pipelined output ( ft /pipe "x" = v ih ) (3,6) notes: 1. transition is measured 0mv from low or high-impedance voltage with the output test load (figure 2). 2. oe is asynchronously controlled; all other inputs are synchronous to the rising clock edge. 3. ads = v il , cnten and cntrst = v ih . 4. the output is disabled (high-impedance state) by ce 0 = v ih or ce 1 = v il following the next rising edge of clock. refer to truth table 1. 5. addresses do not have to be accessed sequentially since ads = v il constantly loads the address on the rising edge of the clk; numbers are for reference use only. 6. " x " denotes left or right port. the diagram is with respect to that port. an an + 1 an + 2 an + 3 t cyc1 t ch1 t cl1 r/ w address data out ce 0 clk oe t sc t hc t cd1 t cklz qn qn + 1 qn + 2 t ohz t olz t oe t ckhz 3242 drw 07 (1) (1) (1) (1) (2) ce 1 t sw t hw t sa t ha t dc t dc (5) t sc t hc , an an + 1 an + 2 an + 3 t cyc2 t ch2 t cl2 r/ w address ce 0 clk ce 1 (4) data out oe t cd2 t cklz qn qn + 1 qn + 2 t ohz t olz t oe 3242 drw 08 (1) (1) (1) (2) t sc t hc t sw t hw t sa t ha t dc t sc t hc (5) (1 latency)
6.42 idt709089/79s/l high-speed 64/32k x 8 synchronous dual-port static ram industrial and commercial temperature rang es 10 timing waveform of a bank select pipelined read (1,2) t sc t hc ce 0(b1) address (b1) a 0 a 1 a 2 a 3 a 4 a 5 t sa t ha clk 3242 drw 09 q 0 q 1 q 3 data out(b1) t ch2 t cl2 t cyc2 (3) address (b2) a 0 a 1 a 2 a 3 a 4 a 5 t sa t ha ce 0(b2) data out(b2) q 2 q 4 t cd2 t cd2 t ckhz t cd2 t cklz t dc t ckhz t cd2 t cklz (3) (3) t sc t hc (3) t ckhz (3) t cklz (3) t cd2 a 6 a 6 t dc t sc t hc t sc t hc timing waveform of a bank select flow-through read (6,7) t sc t hc ce 0(b1) address (b1) a 0 a 1 a 2 a 3 a 4 a 5 t sa t ha clk 3242 drw 09a d 0 d 3 t cd1 t cklz t ckhz (1) (1) d 1 data out(b1) t ch1 t cl1 t cyc1 (1) address (b2) a 0 a 1 a 2 a 3 a 4 a 5 t sa t ha ce 0(b2) data out(b2) d 2 d 4 t cd1 t cd1 t ckhz t dc t cd1 t cklz t sc t hc (1) t ckhz (1) t cklz (1) t cd1 a 6 a 6 t dc t sc t hc t sc t hc d 5 t cd1 t cklz (1) t ckhz (1) notes: 1. b1 represents bank #1; b2 represents bank #2. each bank consists of one idt709089/79 for this waveform, and are setup for dep th expansion in this example. address (b1) = address (b2) in this situation. 2. oe and ads = v il ; ce 1(b1) , ce 1(b2) , r/ w , cnten , and cntrst = v ih . 3. transition is measured 0mv from low or high-impedance voltage with the output test load (figure 2). 4. ce 0 and ads = v il ; ce 1 , cnten , and cntrst = v ih . 5. oe = v il for the right port, which is being read from. oe = v ih for the left port, which is being written to. 6. if t ccs < maximum specified, then data from right port read is not valid until the maximum specified for t cwdd . if t ccs > maximum specified, then data from right port read is not valid until t ccs + t cd1 . t cwdd does not apply in this case. 7. all timing is the same for both left and right ports. port "a" may be either left or right port. port "b" is the opposite of port "a".
6.42 idt709089/79s/l high-speed 64/32k x 8 synchronous dual-port static ram industrial and commercial temperature rang es 11 timing waveform with port-to-port flow-through read (1,2,3,5) notes: 1. transition is measured 0mv from low or high-impedance voltage with the output test load (figure 2). 2. ce 0 and ads = v il ; ce 1 , cnten , and cntrst = v ih . 3. oe = v il for the right port, which is being read from. oe = v ih for the left port, which is being written to. 4. if t ccs < maximum specified, then data from right port read is not valid until the maximum specified for t cwdd . if t ccs > maximum specified, then data from right port read is not valid until t ccs + t cd1 . t cwdd does not apply in this case. 5. all timing is the same for both left and right ports. port "a" may be either left or right port. port "b" is the opposite of port "a". data in"a" clk "b" r/ w "b" address "a" r/ w "a" clk "a" address "b" no match match no match match valid t cwdd t cd1 t dc data out"b" 3242 drw 10 valid valid t sw t hw t sa t ha t sd t hd t hw t cd1 t ccs t dc t sa t sw t ha (4) (4)
6.42 idt709089/79s/l high-speed 64/32k x 8 synchronous dual-port static ram industrial and commercial temperature rang es 12 timing waveform of pipelined read-to-write-to-read ( oe = v il ) (3) timing waveform of pipelined read-to-write-to-read ( oe controlled) (3) notes: 1. transition is measured 0mv from low or high-impedance voltage with the output test load (figure 2). 2. output state (high, low, or high-impedance) is determined by the previous cycle control signals. 3. ce 0 and ads = v il ; ce 1 , cnten , and cntrst = v ih . 4. addresses do not have to be accessed sequentially since ads = v il constantly loads the address on the rising edge of the clk; numbers are for reference use only. 5. "nop" is "no operation." data in memory at the selected address may be corrupted and should be re-written to guarantee data i ntegrity. r/ w address an an +1 an + 2 an + 2 an + 3 an + 4 data in dn + 2 ce 0 clk 3242 drw 11 qn qn + 3 data out ce 1 t cd2 t ckhz t cklz t cd2 t sc t hc t sw t hw t sa t ha t ch2 t cl2 t cyc2 read nop read t sd t hd (4) (2) (1) (1) t sw t hw write (5) r/ w address an an +1 an + 2 an + 3 an + 4 an + 5 data in dn + 3 dn + 2 ce 0 clk 3242 drw 12 data out qn qn + 4 ce 1 oe t ch2 t cl2 t cyc2 t cklz (1) t cd2 t ohz (1) t cd2 t sd t hd read write read t sc t hc t sw t hw t sa t ha (4) (2) t sw t hw
6.42 idt709089/79s/l high-speed 64/32k x 8 synchronous dual-port static ram industrial and commercial temperature rang es 13 timing waveform flow-through read-to-write-to-read ( oe = v il ) (3) timing waveform of flow-through read-to-write-to-read ( oe controlled) (3) notes: 1. transition is measured 0mv from low or high-impedance voltage with the output test load (figure 2). 2. output state (high, low, or high-impedance is determined by the previous cycle control signals. 3. ce 0 and ads = v il ; ce 1 , cnten , and cntrst = v ih . 4. addresses do not have to be accessed sequentially since ads = v il constantly loads the address on the rising edge of the clk; numbers are for reference use only. 5. "nop" is "no operation." data in memory at the selected address may be corrupted and should be re-written to guarantee data i ntegrity. r/ w address an an +1 an + 2 an + 2 an + 3 an + 4 data in dn + 2 ce 0 clk 3242 drw 13 qn data out ce 1 t cd1 qn + 1 t ch1 t cl1 t cyc1 t sd t hd t cd1 t cd1 t dc t ckhz qn + 3 t cd1 t dc t sc t hc t sw t hw t sa t ha read nop read t cklz (4) (2) (1) (1) t sw t hw write (5) r/ w address an an +1 an + 2 an + 3 an + 4 an + 5 (4) data in dn + 2 ce 0 clk 3242 drw 14 qn data out ce 1 t cd1 t ch1 t cl1 t cyc1 t sd t hd t cd1 t dc qn + 4 t cd1 t dc t sc t hc t sw t hw t sa t ha read write read t cklz (2) dn + 3 t ohz (1) (1) t sw t hw oe t oe
6.42 idt709089/79s/l high-speed 64/32k x 8 synchronous dual-port static ram industrial and commercial temperature rang es 14 timing waveform of pipelined read with address counter advance (1) timing waveform of flow-through read with address counter advance (1) notes: 1. ce 0 and oe = v il ; ce 1 , r/ w , and cntrst = v ih . 2. if there is no address change via ads = v il (loading a new address) or cnten = v il (advancing the address), i.e. ads = v ih and cnten = v ih , then the data output remains constant for subsequent clocks. address an clk data out qx - 1 (2) qx qn qn + 2 (2) qn + 3 ads cnten t cyc2 t ch2 t cl2 3242 drw 15 t sa t ha t sad t had t cd2 t dc read external address read with counter counter hold t sad t had t scn t hcn read with counter qn + 1 address an clk data out qx (2) qn qn + 1 qn + 2 qn + 3 (2) qn + 4 ads cnten t cyc1 t ch1 t cl1 3242 drw 16 t sa t ha t sad t had read external address read with counter counter hold t cd1 t dc t sad t had t scn t hcn read with counter
6.42 idt709089/79s/l high-speed 64/32k x 8 synchronous dual-port static ram industrial and commercial temperature rang es 15 timing waveform of write with address counter advance (flow-through or pipelined outputs) (1) timing waveform of counter reset (pipelined outputs) (2) notes: 1. ce 0 and r/ w = v il ; ce 1 and cntrst = v ih . 2. ce 0 = v il ; ce 1 = v ih . 3. the "internal address" is equal to the "external address" when ads = v il and equals the counter output when ads = v ih . 4. addresses do not have to be accessed sequentially since ads = v il constantly loads the address on the rising edge of the clk; numbers are for reference use only. 5. output state (high, low, or high-impedance) is determined by the previous cycle control signals. 6. no dead cycle exists during counter reset. a read or write cycle may be coincidental with the counter reset. addr 0 will be accessed. extra cycles are shown here simply for clarification. 7. cnten = v il advances internal address from ?an? to ?an +1?. the transition shown indicates the time required for the counter to advance. t he ?an +1?address is written to during this cycle. address an clk data in dn dn + 1 dn + 1 dn + 2 ads cnten t ch2 t cl2 t cyc2 3242 drw 17 internal (3) address an (7) an + 1 an + 2 an + 3 an + 4 dn + 3 dn + 4 t sa t ha t sad t had write counter hold write with counter write external address write with counter t sd t hd address an d 0 t ch2 t cl2 t cyc2 q 0 q 1 0 clk data in r/ w cntrst 3242 drw 18 internal (3) address ads cnten t srst t hrst t sd t hd t sw t hw counter reset write address 0 read address 0 read address 1 read address n qn an + 1 an + 2 read address n+1 data out t sa t ha 1 an an + 1 (4) (5) (6) ax t sad t had t scn t hcn (6)
6.42 idt709089/79s/l high-speed 64/32k x 8 synchronous dual-port static ram industrial and commercial temperature rang es 16 3242 drw 19 idt709089/79 ce 0 ce 1 ce 1 ce 0 ce 0 ce 1 a 15 /a 14 (1) ce 1 ce 0 v cc v cc idt709089/79 idt709089/79 idt709089/79 control inputs control inputs control inputs control inputs cntrst clk ads cnten r/ w oe , functional description the idt709089/79 provides a true synchronous dual-port static ram interface. registered inputs provide minimal set-up and hold times on address, data, and all critical control inputs. all internal registers are clocked on the rising edge of the clock signal, however, the self-timed internal write pulse is independent of the low to high transition of the clock signal. an asynchronous output enable is provided to ease asynchronous bus interfacing. counter enable inputs are also provided to stall the operation of the address counters for fast interleaved memory appli- cations. a high on ce 0 or a low on ce 1 for one clock cycle will power down the internal circuitry to reduce static power consumption. multiple chip enables allow easier banking of multiple idt709089/79's for depth expansion configurations. when the pipelined output mode is enabled, two cycles are required with ce 0 low and ce 1 high to re- activate the outputs. depth and width expansion the idt709089/79 features dual chip enables (refer to truth table i) in order to facilitate rapid and simple depth expansion with no require- ments for external logic. figure 4 illustrates how to control the various chip enables in order to expand two devices in depth. the idt709089/79 can also be used in applications requiring ex- panded width, as indicated in figure 4. since the banks are allocated at the discretion of the user, the external controller can be set up to drive the input signals for the various devices as required to allow for 16-bit or wider applications. figure 4. depth and width expansion with idt709089/79 note: 1. a 15 is for idt709089, a 14 is for idt709079.
6.42 idt709089/79s/l high-speed 64/32k x 8 synchronous dual-port static ram industrial and commercial temperature rang es 17 ordering information a power 99 speed a package a process/ temperature range blank i (1) commercial (0 cto+70 c) industrial (-40 cto+85 c) pf 100-pin tqfp (pn100-1) 6 7 9 12 15 709089 709079 512k (64k x 8-bit) synchronous dual-port ram 256k (32k x 8-bit) synchronous dual-port ram 3242 drw 20 s l standard power low power xxxxx device type idt speed in nanoseconds commercial only commercial only commercial only commercial & industrial commercial only note: 1. contact your local sales office for industrial temp range for other speeds, packages and powers. idt dual-port part number dual-port i/o specitications clock specifications idt pll clock device idt non-pll clock device voltage i/o input capacitance input duty cycle requirement maximum frequency jitter tolerance 709089/79 5 ttl 9pf 40% 100 150ps fct88915tt 49fct805t 49fct806t 74fct807t 3242 tbl 13 idt clock solution for idt709089/79 dual-port ordering information for flow-through devices old flow-through part new combined part 70908s/l20 709089s/l9 70908s/l25 709089s/l12 70908s/l30 709089s/l15 3242 tbl 12
6.42 idt709089/79s/l high-speed 64/32k x 8 synchronous dual-port static ram industrial and commercial temperature rang es 18 the idt logo is a registered trademark of integrated device technology, inc. datasheet document history 1/12/99: initiated datasheet document history converted to new format cosmetic and typographical corrections added additional notes to pin configurations page 15 added depth and width expansion note 6/7/99: changed drawing format page 4 deleted note 6 for table ii 11/10/99: replace d idt logo 12/22/99: page 1 removed "separate upper-byte..." line 1/12/00: combined pipelined 709089 family and flow-through 70908 family offerings into one data sheet changed 200mv in waveform notes to 0mv added corresponding part chart with ordering information 2/18/00: pages 8 and 9 changed 220mv waveform notes to 0mv page 9 changed "operation" in heading to "pipelined output", fixed drawing 08 removed pga package 5/24/00: page 3 changed information in truth table ii page 4 increased storage temperature parameters clarified t a parameter page 5 dc electrical parameters?changed wording from "open" to "disabled" added industrial temperature ranges and removed related notes 01/10/02: page 2 added date revision for pin configuration page 5 & 7 removed industrial temp from column headings and values for 15ns from ac & dc electrical characteristics page 16 removed industrial offering from 15ns ordering info and added industrial temp footnote page 1 & 17 replaced idt tm logo with ? logo 06/21/04: consolidated multiple devices into one datasheet removed preliminary status from datasheet page 4 added junction temperature to absolute maximum ratings table added ambient temperature footnote page 5 added 6ns & 7ns speed dc timing numbers to the dc electrical characteristics table page 8 added 6ns & 7ns speed ac timing numbers to the ac electrical characteristics table page 17 added 6ns & 7ns speed grades to ordering information added idt clock solution table page 1 & 18 replaced old ? logo with new tm logo corporate headquarters for sales: for tech support: 2975 stender way 800-345-7015 or 408-727-6116 831-754-4613 santa clara, ca 95054 fax: 408-492-8674 dualporthelp@idt.com www.idt.com

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